TPT since 1996 have been providing the highest quality wire bonding and semiconductor equipment to the microelectronics industry

TPT HB10 Semi-Automatic Wire Bonder
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HB10 Semi-Automatic Wire Bonder
TPT Wire Bonder Logo
TPT Wire Bonder Ball Bonds
TPT HB10 Semi-Automatic Wire Bonder Interface
TPT Wire Bonder Gold Wedge Bonds
TPT Wire Bonder Wire Bond Wedge
TPT Wire Bonder Ball Wedge Bond
The HB10 series bench top wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configurable with a single bondhead for ball and wedge bonding. An intuitive user interface provides the user with access to all of the bond parameters and bonding recepies stored on the machine. The HB10 series also benefits from a motorised Z axis giving more control over the looping of the wire.
  • Motorised Z axis
  • Intuitive Interface with Touch Screen Control
  • Simple change between Ball and Wedge Bonding
  • Deep and Wide Access Bondhead
  • Automatic Bond Height Adjustment
  • Electronic Wire Clamp for Precise Tail Length Control
  • Parameters Entered using Real Units of Force and Time
  • Motorised Wire Spool for Consistent Looping
  • Gold Wire Diameter 17-75µm (0.7 - 3 mil)
  • Aluminium Wire Diameter 17-75µm (0.7 - 3mil)
  • Ribbon Size up to 25x250µm (1x8 mil)
  • 62kHz Transducer PLL Control
  • Ultrasonic Power 0-5 Watt Output
  • Bond Time 0-10 seconds
  • Bond Force 5-150cNm (350cNm option)
  • 90° Wire Feed Angle
  • 17mm Z Travel
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For further information please visit www.tpt-wirebonder.com