The Fico singulation machines have a proven reputation for innovation, quality, reliability and high volume output. Each system has been designed to meet the challenges of today’s ever more demanding manufacturing processes.

FICO Singulation
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Besi's Fico Singulation- Sawing Line
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The Fico singulation machines have a proven reputation for innovation, quality, reliability and high volume output. Each system has been designed to meet the challenges of today’s ever more demanding manufacturing processes. The equipment will significantly increase yields, whilst keeping cost of ownership low. The fully automatic systems are designed for 24/7 singulation of all array based packages. To guard the quality machine and products, vision is added to all key processes throughout the machines. Besi Netherlands remains the only supplier that offers a one-stop-shopping solution for sawing, cleaning, drying, vision inspection, sorting and offloading for BGA and QFN packages. Unique features such as the up-side-down sawing process, the patented chuck system, easy and fast conversion and the reliable gravity based scrap management are just a few of the basic features of the success. ProcessBesi Netherlands not only supplies the machinery for singulation, but also assists you with the determination of your process parameters. The Process Technology department can help you out in the development of new products, where product and machine are optimally adjusted to each other, and help you with the introduction of new packages.
With the launch of its new flagship Fico Sawing Line (FSL), Besi initiates the new era in singulation. The FSL is the only integrated singulation system on the market of a single solution provider. Full parallel sawing and sorting processes, generate the highest output possible, at lowest cost of ownership. Having already proven its unique and innovative capabilities in the field, the FSL sets out to conquer the industry.
  • High Output
  • Fully parallel processing with dedicated units
  • Balanced throughput with optimal process performance
  • Production output of 22,000 UPH can be achieved Large Substrate Handling
  • Capable of handling substrate sizes of up to 152.4 x 300 mm
  • Fully prepared for future increase of high density substrate approach Fast Conversion
  • Fast & easy product conversion to different substrate & product size
  • No tools required and completely automatic alignment of all product related parts Upside Down Sawing
  • Substrates and products are handled in a “live bug” (contacts down) state throughout the system
  • End product is fixed from the top side
  • Substrate is cut from below
  • Cut scrap falls automatically into the waste bin
  • Minimal risk of scrap hitting the sawing blade High Accuracy
  • All substrates are fully analysed with the pre-alignment feature, operating in parallel with the sawing process (zero time loss)
  • The sawing process is taking into account all specific substrate shape and geometry deviations
  • Final package accuracy of ±50 μm at Cpk > 2.0 (6-sigma process control) Features
  • Automatic tray feeder
  • Rework tray
  • 3 reject bins
  • 9 head product sorting
  • Tube offloader (optional)
  • 2.5 kW spindle power
  • 3" blades (70 - 80 mm)
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