The ultrasonic wedge-wedge bonder Bondjet BJ980 serves, with its most flexible and largest working area of 700 mm x 1132 mm, the growing demands for large-sized substrates, especially for solar and battery applications.

BJ980 Heavy Wire Wedge Bonder
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BJ980 Heavy Wire Wedge Bonder
Hesse Mechatronics Logo
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bondhead
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The ultrasonic wedge-wedge bonder Bondjet BJ980 serves, with its most flexible and largest working area of 700 mm x 1132 mm, the growing demands for large-sized substrates, especially for solar and battery applications. The Bondjet BJ980 can be used as a fully automatic machine or operated manually. Hesse offers the only available solution on the market of handling wires from 50 µm up to 600 µm with only one bondhead; Ribbons can be processed up to a size of 2000 µm x 400 µm. Outstanding features are high speed and the largest bonding area in the industry. A change from aluminium to copper can be realized within minutes. Hesse GmbH, as technology leader, has designed the only heavy wire bondhead with non destructive pulltest and a unique transducer integrated sensor for 100% quality monitoring in real-time.

Advanced features and process advantages

  • Most flexible and largest working area in the industry: 700 mm x 1132 mm (27.6″ x 44.6″)
  • 50 µm – 600 µm** bondhead for Al, Cu, AlCu (2 mil - 24 mil)
  • Ribbon up to 2000 µm x 400 µm** (80 mil x 16 mil)
  • Precisely programmable bondforce actuator
  • Wear-free components with Piezo technology
  • Maintenance-free solid state joints
  • Pattern recognition time: 6 ms – 8 ms (search region: 512 × 512 pixels, pattern: 64 × 64 pixels)
  • Rapid image capture with new digital image processing and flash light illumination
  • E-Box: patented solution for optimized tool change and programmable alignment marks for guide, cutter and bond wedge

Central wedge bonder control system

  • A central 23″ touch panel is used to monitor and control the bonder and indexing system
  • A user-friendly calibration wizard and automatic update of calibration data at bondhead change on all available bondheads

Speed

  • Highest UPH on the market due to linear motors Quality
  • Continuous real time monitoring of wire deformation, transducer current and frequency within programmable control limits

Process integrated Quality Control PiQC

  • Detection of further parameters by additional sensor system (e.g. friction) for 100 % quality monitoring in real time (patented); as option
  • Remote pull function on PiQC threshold value for optimized cycle time; up to 30 % safe on equipment
  • Integrated, non-destructive pulltest for wire and ribbon
  • BDE, traceability: integrated CSV-logger or customized implementation

SECS/GEM

  • Integrated standardized server connection for automation and communication, handling via Workbench

MES

  • Interface to Manufacturing Execution Systems, integrated or customized implementation Heavy wire bondheads

Heavy wire and ribbon bondheads for aluminum, copper and AlCu

  • An intelligent bondhead connecting system with integrated memory stores all calibration data and enables bondhead replacement in a few minutes
  • Wire clamp for loop shape control is standard on all bondheads, optional equipped with non-destructive pulltest

* exact range of frequencies on request

**depending on application and wire

Working area

  • X: 700 mm (27.6″); Y: 1132 mm (44.6″); Z: 42 mm (1.65″)
  • P-rotation: 440° Mechatronic bondhead
  • HBK (Frontcut, Backcut)
  • RBK Ribbon (Frontcut)
  • RBK Copper (Frontcut, Backcut) Frequency: 60 kHz*; alternative frequencies on request Cutting methods
  • active, passive, air cut (for frontcut) Wire
  • Al, Cu, AlCu: 50 µm – 600 µm** (2 mil - 24 mil) Ribbon
  • Al, Cu, AlCu: 250 µm x 25 µm up to 2000 µm x 400 µm** (Cu: 200 µm) (10 mil x 1 mil up to 80mil x 16 mil) Ultrasonic
  • Digital ultrasonic generator with PLL (Phase-Locked-Loop), internal frequency resolution <1 Hz
  • Ultrasonic power output : programmable Footprint and weight
  • 1280 mm x 2155 mm x 1822 mm (50.4″ x 84.4″ x 71.7″)(W x D x H)
  • Weight: approx. 3.000 kg Media connectivity
  • Compressed air (high purity)
  • Vacuum
  • 16A/230V AC
  • Digital IOs
  • USB Ports
  • SMEMA connection
  • Gigabit-Ethernet (TCP/IP) Various loop form functions
  • Reproducible loop geometry by wire guide appropriate for the material involved (e.g. pulling wire buffer)
  • Constant wire length and loop height
  • Mechanically demanding loop geometrics by parameterization and individual wire clamp application Manual and fully automated operation
  • Standard components or individually adapted solutions
  • Manual bonding station (with/without heating)
  • Automated bonding station (with/without heating), multi-lane operation → lowest Cost of Ownership (CoO)
  • Indexer / transport system
  • Magazine lifts
  • Visualization
  • Integrated PLC controller Options
  • E-Box: patented solution for optimized tool change and programmable alignment marks for guide, cutter and bond wedge
  • PiQC: Process integrated Quality Control by multi-dimensional signal analysis - integrated in Hesse Mechatronics‘ Workbench
  • BDE, traceability: integrated CSV-logger or customized implementation
  • SECS/GEM: integrated standardized server connection for automation and communication, handling via Workbench
  • MES: interface to Manufacturing Execution Systems, integrated or customized implementation

* exact range of frequencies on request

**depending on application and wire

Heavy Wire Bondhead HBK

  • Type: HBK Froncut, Backcut
  • Transducer (bond frequency): 60 kHz*
  • Wire: Al, Cu, AlCu: 50 µm – 600 µm** (2 mil – 24 mil), application-dependent
  • Bonding force adjustable
  • Wedge length: 2.5″for 60 kHzHeavy Wire Bondhead RBK Ribbon
  • Type Ribbon: RBK Froncut
  • Transducer (bond frequency): 60 kHz*
  • Wire: 250 µm x 25 µm up to 2000 µm x 400 µm** (Cu: 200 µm)(10 mil x 1 mil up to 80 mil x 16 mil)
  • Bonding force adjustable
  • Wedge length: 2.622″Heavy Wire Bondhead RBK Copper
  • Type Copper: RBK Froncut, Backcut
  • Transducer (bond frequency): 60 kHz*
  • Wire: Cu : 50 µm – 600 µm** (2 mil – 24 mil)
  • Bonding force adjustable
  • Wedge length: 2.733″

*exact range of frequencies on request

**depending on application and wire

Adjustment tool for wire bonders, The E-Box of the Hesse GmbH is a patent-registered visualisation system for control supported, reproducible adjustments of bondhead elements.

It includes a camera for optical displaying of wedge, cutter and wire guide as well as a graphical support for adjustment and positioning control. E-Box allows significant time reduction for setting up the machine. Software enhanced optical adjustment system for wedge, cutter and wire guide / wire clamp.

E-Box for Bonder – Advantages during Production

  • Better reproducibility of the adjustment depending attributes (e.g. loop forming) after change of wearing parts
  • Longer life time of wearing parts Advantages for Bond Process
  • System for reproducible set-up of wedge, cutter and wire guide / wire clamp
  • Set-up without microscope
  • Free programmable, specified positions for bondhead elements
  • shown as limitation line
  • different views selectable (different sides, bottom, front etc.)
  • Minimizes time expenditure for set-up work, set-up control and readjustment
  • Process secured adjustment of wire feed elements (wedge, wire clamp, wire guide, cutter etc.)
  • Graphical supported, visual control of wedge and wire guide position, distance between wedge and wire clamp, gap of wire clamp, wire pass, cutter cutting position

Process integrated Quality Control, The Hesse GmbH has implemented a new Process integrated Quality Control system (PiQC) that is unique to the global wire bonding market.

A sensor integrated into the Transducer allows for the first time a multi-dimensional signal analysis of the bond process. PiQC calculates a bond quality index value in realtime, using significant signals from the wire-bonding process.

Advantages for volume production:

  • Inspection of every bond
  • No mechanical load of the bond connection
  • Product specific configuration of the quality control systemFeedback from the process
  • Mechanical oscillation of the wedge
  • Friction at bond surface
  • Transducer current
  • Ultrasonic frequency progression
  • Wire deformationQuality statements by PiQC
  • PiQC calculates a quality index for each bond based on the actual feedback signal from the process
  • The signal related components of the quality index can be displayed graphically at any timeTeach mode for reference data
  • Detailed automatic analysis of the welding process
  • Extraction of process-specific reference data
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