Bondjets BJ955 and BJ959 of the new bonder generation are heavy wire ultrasonic wedge-wedge bonders developed for the fully automated processing of a wide range of large-sized substrates, chips and other materials. The systems can be used as a fully automatic machine or operated manually.

Bondjet BJ955/BJ959 Fully Automatic Heavy Wire Wedge Bonder

BJ955/959 Fully Automatic Heavy Wire Wedge Bonder
Hesse Mechatronics
BJ955/959 Fully Automatic Heavy Wire Wedge Bonder
BJ955/959 Fully Automatic Heavy Wire Wedge Bonder
BJ955/959 Fully Automatic Heavy Wire Wedge Bonder
Bondjet BJ955 and BJ959 belong to the new generation of ultrasonic wedge-wedge bonders developed for the fully automated processing of a wide range of large-sized substrates, chips and other materials. The systems can be used as a fully automatic machine or operated manually. Hesse offers the only available solution on the market of handling wires from 50 μm up to 600 μm** with only one bondhead. Bondjet BJ955/959 are characterized by several new features:
  • Optimized pattern recognition
  • Software features for the growing demand of connectivity and industry 4.0 (e.g. Hesse Bonder Network, remote control of PR, improved MES integration, ...)
  • Hesse Assist Tools: load cell, bondtool and wire spool detection, tool calibration without wedge gauge for operator independency.

Outstanding features include high speed and the largest bonding area. A change from aluminium to copper can be realized within minutes. Hesse GmbH has designed the only heavy wire bondhead with a non destructive pulltest and a unique transducer integrated sensor for 100 % quality monitoring in real time. Advanced features available on the Bondjet BJ955 and BJ959 are designed to meet your present and future requirements and greatly enhance productivity. In addition to a standard configuration Hesse offers automation concepts individually adapted for every application.

Advanced features and process advantages

  • 50 μm – 600 μm** bondhead for Al, Cu, AlCu (2 mil - 24 mil)
  • Improved wire handling: short distance between bondhead and spool
  • Optimized pattern recognition: image capture with new digital image processing and flash
  • Hesse Assist Tools (option):
  • E-Box: patented solution for optimized tool change and programmable alignment marks for cutter, wire guide and bond wedge
  • Automated bondforce calibration; a load cell prevents operating error and ensures robust processes
  • Innovative bondtool detection
  • Wire spool detection
  • Automated bondtool calibration without wedge gauge
  • Precisely programmable bondforce actuator
  • Loop generator for individual loops
  • Wear-free components with Piezo technology
  • Maintenance-free solid state joints
  • Pre-setting of bondheads via EEPROM

Flexibility

Working area

  • BJ955: 305 mm x 410 mm (12.0" x 16.1")
  • BJ959: 370 mm x 560 mm (14.6" x 22.0")
  • Flexible use of the large working area, e.g. vacuum clamping of several 5" x 7" standard DCBs
  • Maximization of throughput by automation (two/more parallel lanes)

Quality

  • Continuous real time monitoring of wire deformation, transducer current and frequency within programmable control limits
  • Process integrated Quality Control PiQC: detection of further parameters by additional sensor system (e.g. friction) for 100 % quality monitoring in real time (patented); as option
  • Remote pull function on PiQC threshold value for optimized cycle time; up to 30 % save on equipment
  • Integrated, non destructive pulltest for wire and ribbon

Heavy wire bondheads

  • Heavy wire and ribbon bondheads for Al, Cu and AlCu
  • An intelligent bondhead connecting system with integrated memory stores all calibration data and enables bondhead replacement in a few minutes
  • Wire clamp for loop shape control is standard on all bondheads; optionally equipped with non destructive pull test

**depending on application and wire

Working area

  • BJ955: X: 305 mm (12"); Y: 410 mm (16.1"); Z: 42 mm (1.65")
  • BJ959: X: 370 mm (14.6"); Y: 560 mm (22.0"); Z: 42 mm (1.65")
  • P-rotation: 440°

Mechatronic bondhead

  • HBK (Frontcut, Backcut)
  • RBK Ribbon (Frontcut)
  • RBK Copper (Frontcut, Backcut) Frequency: 60 kHz*; alternative frequencies on request

Cutting methods

  • active, passive, air cut (for frontcut)

Wire

  • Al, Cu, AlCu: 50 μm – 600 μm** (2 mil – 24 mil)

Ribbon

  • Al, Cu, AlCu: 250 μm x 25 μm up to 2000 μm x 400 μm** (Cu: 200 μm) (10 mil x 1 mil up to 80 mil x 16 mil)

Ultrasonic

  • Digital ultrasonic generator with PLL (Phase Locked Loop), internal frequency resolution <1 Hz
  • Programmable ultrasonic power output

Footprint and weight

  • BJ955: 740 x 1484 x 1910 mm (29.1" x 58.4" x 75.2"), appr. 1100 kg
  • BJ959: 805 x 1634 x 1910 mm (31.7" x 64.3" x 75.2"), appr. 1250 kg

Media connectivity

  • Compressed air (high purity)
  • Vacuum
  • 16A/230V AC
  • Digital IOs
  • USB Ports
  • SMEMA connection
  • Gigabit Ethernet (TCP/IP)
  • Profibus support

Various loop form functions

  • Reproducible loop geometry by wire guide appropriate for the material involved and moving wire buffer
  • Constant wire length and loop height
  • Mechanically demanding loop geometrics by parameterization and individual wire clamp application
  • Individual loop shapes by configurable loop trajectory generator

Manual and fully automated operation

  • Standard components or individually adapted solutions
  • Manual bonding station (with/without heating)
  • Automated bonding station (with/without heating), multi-lane operation → lowest Cost of Ownership (CoO)
  • Indexer / transport system
  • Magazine lifts
  • Visualization
  • Integrated PLC controller
  • Integrated operation in machine control (TwinCAT®)

Software options

  • Hesse Bonder Network (HBN): complete line management, synchronization of data, easy integration of new machines via Plug & Produce, no server necessary
  • PBS Server & Workbench 2.0: central data management, line management, automatic backup system, remote pattern recognition
  • TwinCAT® Automation: integration of control software for automation in Hesse Bonder Interface
  • SECS/GEM: integrated standardized server connection for automation and communication, handling via Workbench
  • MES: interface to Manufacturing Execution Systems, integrated or customized implementation
  • CSV-Logger: storage of all machine and process data, e.g. bond positions etc.
  • Login via USB stick

* exact range of frequencies on request

**depending on application and wire

Heavy Wire Bondhead HBK

  • Type: HBK Froncut, Backcut
  • Transducer (bond frequency): 60 kHz*
  • Wire: Al, Cu, AlCu: 50 µm – 600 µm** (2 mil – 24 mil), application-dependent
  • Bonding force adjustable
  • Wedge length: 2.5″for 60 kHzHeavy Wire Bondhead RBK Ribbon
  • Type Ribbon: RBK Froncut
  • Transducer (bond frequency): 60 kHz*
  • Wire: 250 µm x 25 µm up to 2000 µm x 400 µm** (Cu: 200 µm)(10 mil x 1 mil up to 80 mil x 16 mil)
  • Bonding force adjustable
  • Wedge length: 2.622″Heavy Wire Bondhead RBK Copper
  • Type Copper: RBK Froncut, Backcut
  • Transducer (bond frequency): 60 kHz*
  • Wire: Cu : 50 µm – 600 µm** (2 mil – 24 mil)
  • Bonding force adjustable
  • Wedge length: 2.733″

*exact range of frequencies on request

**depending on application and wire

Adjustment tool for wire bonders, The E-Box of the Hesse GmbH is a patent-registered visualisation system for control supported, reproducible adjustments of bondhead elements.

It includes a camera for optical displaying of wedge, cutter and wire guide as well as a graphical support for adjustment and positioning control. E-Box allows significant time reduction for setting up the machine. Software enhanced optical adjustment system for wedge, cutter and wire guide / wire clamp.

E-Box for Bonder – Advantages during Production

  • Better reproducibility of the adjustment depending attributes (e.g. loop forming) after change of wearing parts
  • Longer life time of wearing parts Advantages for Bond Process
  • System for reproducible set-up of wedge, cutter and wire guide / wire clamp
  • Set-up without microscope
  • Free programmable, specified positions for bondhead elements
  • shown as limitation line
  • different views selectable (different sides, bottom, front etc.)
  • Minimizes time expenditure for set-up work, set-up control and readjustment
  • Process secured adjustment of wire feed elements (wedge, wire clamp, wire guide, cutter etc.)
  • Graphical supported, visual control of wedge and wire guide position, distance between wedge and wire clamp, gap of wire clamp, wire pass, cutter cutting position

Process integrated Quality Control, The Hesse GmbH has implemented a new Process integrated Quality Control system (PiQC) that is unique to the global wire bonding market.

A sensor integrated into the Transducer allows for the first time a multi-dimensional signal analysis of the bond process. PiQC calculates a bond quality index value in realtime, using significant signals from the wire-bonding process.

Advantages for volume production:

  • Inspection of every bond
  • No mechanical load of the bond connection
  • Product specific configuration of the quality control systemFeedback from the process
  • Mechanical oscillation of the wedge
  • Friction at bond surface
  • Transducer current
  • Ultrasonic frequency progression
  • Wire deformationQuality statements by PiQC
  • PiQC calculates a quality index for each bond based on the actual feedback signal from the process
  • The signal related components of the quality index can be displayed graphically at any timeTeach mode for reference data
  • Detailed automatic analysis of the welding process
  • Extraction of process-specific reference data
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