COVID-19 response: Accelonix continues to operate as close to normal as possible while adhering to the government regulations. All orders are processed and we currently experience no disruptions to our supply chains.
Our PCBA testing facility is open for board testing and we offer remote support of all equipment under contract. Essential site visits can be carried out in keeping with the guidelines.
Please do not hesitate to contact us in the usual way.

The Bondjet BJ931 is an ultrasonic wedge bonder developed especially for maxtrix leadframe applications. The application of two bondheads enables to bond two different wire sizes as well as a combination of wire and ribbon.

Bondjet BJ931 Dual Head Leadframe Wedge Bonder

BJ931 Dual Head Leadframe Wedge Bonder
BJ931 Bondhead
BJ931 Dual Bondheads
BJ931 Ebox
The Bondjet BJ931, Fully Automatic Dual-Head Leadframe Wedge Bonder is an ultrasonic wedge bonder developed especially for maxtrix leadframe applications. The application of two bondheads enables to bond two different wire sizes as well as a combination of wire and ribbon.The fully automatic dual-head leadframe wedge bonder Bondjet BJ931 meets the latest technology and flexibility demands for automotive and power electronics applications; handling heavy aluminium, copper wire and ribbon on two specialized bondheads that can be exchanged. A robust, clean design, low maintenance requirements, user-friendly software and service support functions are integrated into the Bondjet BJ931, along with Hesse Mechatronics’ industry-leading PiQC™ process monitoring system.

Advanced features and process advantages

  • Precisely programmable bondforce actuator
  • Wear-free components with Piezo technology
  • Maintenance-free solid state joints
  • Integrated, non destructive pulltest for wire and ribbon
  • Automated bondforce calibration
  • Pattern recognition time: 6 ms – 8 ms (search region: 512 × 512 pixels, pattern: 64 × 64 pixels)
  • Rapid image capture with new digital image processing and flash light illumination


Patented solution for optimized tool change and programmable alignment marks for cutter, wire guide and bond wedge

Central wedge bonder control system

  • A central 23″ touch panel is used to monitor and control the bonder and indexing system
  • Metal keypad and robust trackball for industrial use
  • User-friendly calibration wizard and automatic update of calibration data at bondhead change on all available bondheads Speed
  • Highest UPH due to linear motors for bonder and indexer Quality
  • Continuous real time monitoring of wire deformation, transducer current and frequency within programmable control limits
  • Process integrated Quality Control PiQC: detection of further parameters by additional sensor system (e.g. friction) for 100 % quality monitoring in real time (patented); as option
  • Remote pull function on PiQC threshold value for optimized cycle time; up to 30 % save on equipment
  • Inline pull modules for non-destructive pulltest with no influence on process timeInterchangeable bondheads
  • The Bondjet BJ931 supports heavy wire and ribbon bondheads for aluminum, copper and AlCu
  • An intelligent bondhead connecting system with integrated memory stores all calibration data and enables bondhead replacement in a few minutes
  • Wire clamp for loop shape control is standard on all heavy wire bondheads, optionally equipped with non-destructive pull test

Working area

  • X: 100 mm (3.9″), Y: 90 mm (3.5″), Z: 42 mm (1.65″)
  • P: 440° Mechatronic bondhead
  • HBK (Frontcut, Backcut)
  • RBK Ribbon (Frontcut)
  • RBK Copper (Frontcut, Backcut) Frequency: 60 kHz*; alternative frequencies on request Cutting methods
  • active, passive, air cut (for frontcut) Wire
  • Al, Cu, AlCu: 50 μm – 600 μm** (2 mil – 24 mil) Ribbon
  • Al, Cu, AlCu: 250 μm x 25 μm up to 2000 μm x 400 μm** (Cu: 200 μm) (10 mil x 1 mil up to 80 mil x 16 mil) Ultrasonic
  • Digital ultrasonic generator with PLL (Phase Locked Loop), internal frequency resolution <1 Hz
  • Programmable ultrasonic power output Footprint and weight
  • 1650 mm x 1210 mm x 1895 mm (65.0″ x 47.3″ x 74.6″) (W x D x H)
  • Weight: approx. 1370 kg Media connectivity
  • Compressed air (high purity)
  • Vacuum
  • 16A/230V AC
  • Digital IOs
  • USB Ports
  • SMEMA connection
  • Gigabit Ethernet (TCP/IP)
  • Profibus support High speed leadframe indexer
  • Strip dimensions : 100 mm - 280 mm length, 15 mm - 90 mm width, max. 3.0 mm down-set
  • Substrate types: SOIC, SO8, SOL8, SOT, SOT23, SC70, TO220, powerQFN, QFN, DPAK, DFN, DSO, COB, multi-lead SOP, matrix L/F, flatboat, programmable pitch etc.
  • Index time: 100 ms for typical TO 220 device (includes clamping)
  • Magazine size: 115 mm - 285 mm length, 20 mm - 100 mm width, 50 mm - 200 mm height Options
  • Process integrated Quality Control PiQC: detection of further parameters by additional sensor system (e.g. friction) for 100 % quality monitoring in real time (patented)
  • Inline pull modules: up to 4 modules per bondhead for a nondestructive pulltest (up to a total of 8 per system)
  • Bondhead integrated pulltest
  • Automated bondforce calibration
  • BDE, traceability: integrated CSV-Logger or customized implementation
  • SECS/GEM: integrated standardized server connection for automation and communication, handling via Workbench
  • MES: interface to Manufacturing Execution Systems, integrated or customized implementation

Heavy Wire Bondhead HBK09

  • Type: HBK09 Frontcut and backcut
  • Transducer: 60 kHz, optional 40 kHz
  • Wire: Al, AlCu: 50 µm (2 mil) – 600 µm (24 mil), application-dependent
  • Bond Force: 2500 cN adjustable
  • Wedge: 2.5″ for 60 kHzHeavy Wire Bondhead RBK02
  • Ribbon Type: RBK02 Frontcut
  • Transducer (bond frequency): 57 kHz
  • Ribbon Dimensions: Al, Cu, AlCu: 250 µm x 25 µm to 2000 µm x 400 µm (Cu: 200 µm)(10 mil x 1 mil to 80 mil x 16 mil)
  • Bonding force: 5000 cN adjustable
  • Wedge length: 2.622″ for ribbon wedgesHeavy Wire Handling
  • Wire Feed: Motorized wire de-reeler
  • Missing Wire Detection: Yes
  • Wire Spool Size: 50 mm – 120 mm OD10 mm – 11 mm ID22 mm – 45 mm width

Adjustment tool for wire bonders, The E-Box of the Hesse GmbH is a patent-registered visualisation system for control supported, reproducible adjustments of bondhead elements. It includes a camera for optical displaying of wedge, cutter and wire guide as well as a graphical support for adjustment and positioning control.

E-Box allows significant time reduction for setting up the machine. Software enhanced optical adjustment system for wedge, cutter and wire guide / wire clamp.

E-Box for Bonder – Advantages during Production

  • Better reproducibility of the adjustment depending attributes (e.g. loop forming) after change of wearing parts
  • Longer life time of wearing parts

Advantages for Bond Process

  • System for reproducible set-up of wedge, cutter and wire guide / wire clamp
  • Set-up without microscope Free programmable, specified positions for bondhead elements shown as limitation line
  • Different views selectable (different sides, bottom, front etc.)
  • Minimizes time expenditure for set-up work, set-up control and readjustment
  • Process secured adjustment of wire feed elements (wedge, wire clamp, wire guide, cutter etc.)
  • Graphical supported, visual control of wedge and wire guide position, distance between wedge and wire clamp, gap of wire clamp, wire pass, cutter cutting position

Process integrated Quality Control, The Hesse GmbH has implemented a new Process integrated Quality Control system (PiQC) that is unique to the global wire bonding market.

A sensor integrated into the Transducer allows for the first time a multi-dimensional signal analysis of the bond process. PiQC calculates a bond quality index value in realtime, using significant signals from the wire-bonding process.

Advantages for volume production

  • Inspection of every bond
  • No mechanical load of the bond connection
  • Product specific configuration of the quality control system feedback from the process
  • Mechanical oscillation of the wedge
  • Friction at bond surface
  • Transducer current
  • Ultrasonic frequency progression
  • Wire deformation quality statements by PiQC
  • PiQC calculates a quality index for each bond based on the actual feedback signal from the process
  • The signal related components of the quality index can be displayed graphically at any time teach mode for reference data
  • Detailed automatic analysis of the welding process
  • Extraction of process-specific reference data

For further information please visit www.hesse-mechatronics.com