Fully Automatic Wire Bonder

Hesse Mechatronics GmbH, formerly 'Hesse & Knipps' is a world leader in the field of ultrasonic welding technology for the microelectronics and semiconductor industries.

Hesse’s latest generation of fully automatic wire bonders offer advanced ultrasonic bonding technologies for fine wire and heavy wire bonding applications. High speed, large area ultrasonic bonding solutions for wedge bonding, ball bonding and ribbon bonding processes. Innovative technical advancements, such as Process Integrated Quality Control or wear-free piezo bondheads, position Hesse at the leading edge of ultrasonic wire bonding technology. Advanced, user friendly software provides a range of powerful features whilst retaining a helpful and intuitive interface. Exchangeable bondheads provide flexibility to accommodate a broad range of wire bonding applications on a single platform.

Hesse’s headquarters along with their manufacturing facilities are located in Paderborn, Germany.