Royce AP+ Automated Die Sorter

The system is very flexible and easy to set up. Ideal for high mix, medium volume production or prototyping, wafer sizes from 3 inch (150mm) to 12 inch (300mm) and film frames and rings of any type are easily accommodated. Designed for quick change over of new die sizes with drop in output tooling. Our flexible wafer mapping approach and rich die binning options enables rapid accommodation of both current and legacy wafer map formats. Some applications involve die surfaces which cannot be touched by conventional surface vacuum pick up tips. Our unique optional Non Surface Contact (NSC) technology readily solves this problem. Examples include GaAs die with air bridges, biochips and ink jet heads. Die inversion (die flipping) is also an option, making inline inversion of bumped die into output trays a simple process. Royce die sorters have uniquely solved many die handling problems in Laser Diodes, MEMS, Microfluidics, Ink Jet head, Lab on Chip (LOC) and BioChip manufacturing. Let our experienced applications engineers help you configure the Autoplacer MP300 to meet your needs.

• Highly Flexible, Low Cost, Fully Automatic Pick and Place
• Designed for Automatic Die Sorting from Wafer Maps, Including Multi Project Wafers (Pizza Masks)
• Easy to set up with DieSort Manager Software and Expanded Wafer Map Library
• Fast Change to New Die Size and Output Medium with Pre-Leveled Output Fixtures
• Flexible Platform Handling 3 inch to 300 mm Wafers on Many Hoop and Frame Types
• Picks at Programmable Heights, Speeds and with NSC Edge Grippers or Vacuum Pick-up

• Die Size Range 0.2 mm sq to > 25 mm sq for tray placement, 0.5 um sq to approx. 17 mm sq for tape placement
• Pick-up Technology Surface or top edge contact vacuum tips
• Optional non-surface contact Vespel edge grip
• Placement ± 12.5 micron placement repeatability
• Die Sort Modes Wafer mapping (SEMI E142, Electroglas 40x0, August Simplified INF, SEMI G85-0703, SEMI G851101,custom, create your own)
• Ink dot recognition, pick all die, throughput application dependent, 1.3 seconds minimum time per cycle
• Die Input Film frames or wafer rings, in all current designs, for wafers up to 300 mm diameter
• Waffle packs, Gel-Paks, JEDEC trays, and custom trays
• Options Die Inverter, Post-Place Vision Inspection of Die in Carrier Tape