COVID-19 response: Accelonix continues to operate as close to normal as possible while adhering to the government regulations. All orders are processed and we currently experience no disruptions to our supply chains.
Our PCBA testing facility is open for board testing and we offer remote support of all equipment under contract. Essential site visits can be carried out in keeping with the guidelines.
Please do not hesitate to contact us in the usual way.

For over 25 years, Royce Instruments, Inc has been an innovative global leader for design and manufacturing high accuracy, low force bond testing equipment.

Royce 610 Multitest Bond Tester
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Royce 610 Multitest Bond Tester
Royce Bond Testers Logo
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The Royce 610 Dedicated Wire Pull Bond Tester is designed for maximum throughput at an affordable cost, in a reliable system. The controls of the 610 are simple and ergonomic. Using the extremely flexible Leica S6 microscope, the 610 easily adjusts to accommodate a broad spectrum of users.
  • The familiar controls make training quick and easy, minimizing downtime
  • Includes the standard computer mouse controls with: the hook, height and rotation, along with triggering the test
  • A numeric keypad allows the operator to enter failure codes, and the test results are visible on the LCD panel built into the mainframe
  • Able to perform both destructive and non-destructive tests, the 610 collects force data against the wire every 10 microseconds
  • When performing destructive bond testing the maximum load is monitored and the test stops automatically when the load force falls from its maximum
  • Non-destructive testing is controlled so that the rate of load application exactly meets the user's programmed limit
  • Load variance also is programmable by the user prior to testing to provide stricter controls
  • Data output to any PC using RS232
  • Ergonomic design to support operator comfort over long shifts
  • Simple calibration interface to allow user to quickly and easily check and recalibrate the instrument with on-screen instructions
  • Optional strip printer
  • Optional keypad for enhanced failure code input
  • Optional external royce PC with bond test manager software for data storage and networking
  • Maximum Wire Pull Test Force: 100 gf
  • Total System Accuracy: ±0.1%
  • Z Resolution: ±2.5 μm
  • Computer: Optional External Windows 7 PC with Bond Tester Manager
  • Part Manipulation: Manual Manipulators (MPS-12 and MPS-14)

For further information please visit http://www.royceinstruments.com/