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In back-end semiconductor manufacturing, the die attach process is a critical step. The continuously increasing requirements of today's applications set high standards in die bonding. Besi’s die attach equipment is based on unique and innovative concepts offering economical benefits to customers.

Esec 2100
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Besi Esec 2100 Series
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In back-end semiconductor manufacturing, the die attach process is a critical step. At first glance, die attach seems to be a simple process step in the semiconductor manufacturing chain. However, the continuously increasing requirements of today's applications set high standards in die bonding. Besi'sTM die attach equipment is based on unique and innovative concepts, offering economical benefits to customers. The impressive Esec 2100 range of high performance die bonder systems is designed to address nearly all industrial semiconductor die attach applications. From smart card to stacked die, through to high temperature die bonding applications, the Esec 2100 family of fully automatic, industrial die attach platforms is well suited to meet all current and future challenges.
The Die Bonder Esec 2100 SC is the most flexible 300 mm high speed platform, capable of running the smart card tape. It is the most effortless system to run, assist and control production, resulting in a quantum leap in throughput and yield at the lowest cost of ownership. At its introduction, this innovative platform was awarded with the prestigious Swiss Technology Award.

    Cutting-Edge Machine Concept

  • Single clamp transport system
  • 100% post bond QC inspection at high speed
  • Key alignment tasks performed by cameras make many mechanical adjustments obsolete
  • Optional 3 zone heating for pre-curing (accuracy) and void control (dehumidification)
  • Highest Up Time

  • Real time process monitoring through 4 live images of process zones
  • Constant status control with real time wafer, tape and magazine viewer
  • Efficient learning and error recovery thanks to context sensitive online help
  • Highest Speed at 25 µm Accuracy

  • Phi-Y Pick and Place with symmetrical design for short settling time, resulting in the highest UPH
  • Best placement accuracy through vibration control
  • Highest stiffness for highest speed and accuracy
  • Fastest Time to Yield

  • Tool-less exchange of product and easy loading of material for the fastest product changeovers
  • Teach and setup wizards and parameter teach verification eliminate setup errors
  • Recipe transfer from machine to machine enables fast conversion
  • The Platform of the Future

  • 3rd generation pick and place
  • 50 N bond force standard
  • Third process station enables easy adaptation to future cutting-edge applications
The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach applications such as QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA and LGA. It is the most effortless system to run, assist and control production, resulting in a quantum leap in throughput and yield at the lowest cost-of-ownership. At its introduction, this innovative platform won the prestigious Swiss Technology Award.

    Cutting-Edge Machine Concept

  • Real time process monitoring through 4 live images of process zones
  • Constant status control with real time wafer, strip and magazine viewer
  • Efficient learning and error recovery thanks to context sensitive online help
  • Highest Speed at 20 µm Accuracy

  • Very short pick & place cycle time due to the revolutionary Phi-Y concept, combining rotational and linear movements
  • New "light & amp;rigid" pick & place structure, advanced trajectory control, as well as a liquid cooling system, ensuring excellent accuracy at highest speed
  • Placement accuracy down to 15 µm (3 sigma) using "High Accuracy Mode"
  • Fastest time to Yield

  • Tool-less exchange of product specific parts, for the fastest product changeovers
  • Teach and setup wizards and parameter teach verification eliminate setup errors
  • Recipe transfer from machine to machine enables fast conversion
  • Hot and cold processes supported: epoxy, soldering, thermo-compression and eutectic
  • The Platform of the Future

  • New controller hardware using Gigabit Ethernet communication, enabling advanced processes
  • Next generation platform, ensuring upgrades and expansion of functionalities at any time
  • Scalable performance & application range
The Esec 2100 sD plus, the 2nd generation of the proven Die Bonding Family, offers a wide range of benefits with the sole target of producing the highest quality at the lowest cost per die placement. Special handling and operating aspects of stacked die are incorporated in this revolutionary machine, further redefining Stacked Die Bonding.

    12 µm Accuracy @ 3 Sigma (film based applications in High Accuracy Mode)

  • Revolutionary Phi-Y pick and place
  • Stable high accuracy thanks to vibration control
  • Widest Application Range

  • From epoxy to the most advanced Stacked Die applications (amongst others BGA, CSP-BGA, SiP-BGA, FBGA)
  • Patented ultra-thin die pick up solutions
  • 50 N bond force as standard
  • Up to 125 mm substrate width
  • Shortest Time to Yield

  • Recipe transfer from machine to machine
  • Operator independent results due to auto calibration concept
  • Tool-less exchange of expansion unit in less than 30 seconds
  • Highest Up Time

  • 4 live camera pictures on display at all time
  • Strip and magazine viewers
  • Online help
  • Easy maintainability
  • Platform of the Future

  • Third process station for additional process expansions
  • Expandable for the future thanks to revolutionary machine concept
The Esec 2100 sD PPP plus is the only real Two-in-One Die Bonder on the market. Its instant switching capability between parallel and standard production mode, guarantees to always produce the highest quality at the lowest cost per die placement. Special handling and operating aspects of Stacked Die are incorporated in this revolutionary machine, further redefining Stacked Die Bonding.

    10 µm Accuracy @ 3 Sigma (film based applications in Parallel Production Mode)

  • Parallel Pick & Place for parallel picking and bonding
  • Revolutionary Phi-Y pick and place
  • Stable high accuracy thanks to vibration control
  • Widest Application Range

  • Two-in-One machine concept for instant switching between standard and parallel mode, always provides the best possible performance from epoxy to the most advanced Stacked Die applications
  • Patented ultra-thin die pick up solutions
  • 50 N bond force as standard
  • Up to 125 mm substrate width
  • Shortest Time to Yield

  • Recipe transfer from machine to machine
  • Operator independent results due to auto calibration concept
  • Tool-less exchange of expansion unit in less than 30 seconds
  • Highest Up Time

  • 4 live camera pictures on display at all time
  • Strip and magazine viewers
  • Online help
  • Easy maintainability
  • Platform of the Future

  • Third process station for additional process expansions
  • Expandable for the future thanks to revolutionary machine concept
The latest member of the field proven High-end Esec 2100 sD machine family is featuring the new 3rd Generation High Resolution Vision System, a completely redesigned clean unit as well as new easy to use GUI. The new Esec 2100 sD advanced Die Bonder is able to handle the most challenging thin die and warped strip packages. The proven “light & rigid” structure of the Pick & Place ensures highest accuracy and maximized throughput. This fine piece of Esec High-end Equipment guarantees maximum flexibility and outstanding process capabilities meeting today’s and tomorrow’s requirements.

    Next Generation Two in One Die Bonder

  • Two in one machine configuration
  • Single Pick & Place and additional parallel Pick & Place
  • Instant switching between single and parallel Pick & Place mode
  • New transfer table axis in parallel module with significant higher axis performance
  • Excellent standard die productivity
  • Superior ultra-thin die productivity
  • Speed & Accuracy

  • Superior "light & rigid" P&P design
  • Voice coil drive X axis
  • Enhanced Z axis with integrated encoder
  • High performance Y axis with optional liquid cooling system
  • Advanced Real time trajectory controller
  • High Accuracy Mode
  • High Flow Bond Head
  • New Generation Clean Kit

  • Air flow from front to back
  • Programmable air flow from 3 to 12 qm
  • Standby mode if no strip loaded
  • ULPA filter available
  • ISO class 4 (with clean speed)
  • Anti contamination capabilities remove dust, an additional particles kit is available
  • 3rd Generation Vision System

  • High resolution 4 mega pixel cameras
  • Sharp image with 12.4 µm/pixel resolution
  • Dual colour illumination featuring red and white light
  • Three light sources per camera (direct, indirect and vertical)
  • High resolution enabling cracked die and defects detection
  • Ease of Use

  • New 16:9 GUI
  • Two inspection image display mode
  • Display of inspection image and statistic or inspection image and wafer map at the same time
  • Graphical status overview of vacuum, air pressure temperature for all purposes
Esec 2100 DS, the flexible and fast, high temperature Die Bonding Platform for Leadframe Applications. The latest member of the field proven standard machine for high end production is combining the revolutionary Phi-Y pick & place and a flexible hot tunnel strip handler with forming gas or nitrogen atmosphere. The Esec 2100 DS is the most flexible and versatile Die Bonder for diffusion soldering and sintering for the time to come.

    Cutting-Edge Machine Concept

  • Real time process monitoring
  • Constant status control with real time wafer, strip and magazine viewer
  • Efficient learning and error recovery thanks to context sensitive online help
  • Excellent gas atmosphere with widest application range
  • Highest Speed at 25 µm Accuracy

  • Very short pick & place cycle time due to the revolutionary Phi-Y concept combining rotational and linear movements
  • New "light & rigid" pick & place structure, advanced trajectory control as well as a liquid cooling system, ensuring excellent accuracy at the highest speeds
  • Placement accuracy down to 25 µm (3 sigma) at 450°C maximum bond temperature
  • Fastest time to Yield

  • Fast exchange of product specific parts for the shortest product changeovers
  • Teach and setup wizards and parameter teach verification eliminates setup errors
  • Recipe transfer from machine to machine enables fast conversion
  • Hot processes supported: Diffusion Soldering, In Situ - Sintering thermo-compression and eutectic
  • The Platform of the Future

  • New controller hardware using Gigabit Ethernet communication enabling advanced processes
  • Next generation platform ensuring upgrades and expansion of functionalities at any time
  • Scalable performance & application range co-development
  • Involved in power package design
  • Work closely together with customers and suppliers
The Flip Chip Bonder Esec 2100 FC hS is the 3rd generation of the market leading High Speed FC platform, capable of running an extensive range of FC applications such as FCOL, FC-MIS, FC-SIP, FCCSP, FCBGA as well as emerging packages such as CSP-LED. It is the most effortless system to run, assist and control production, resulting in a quantum leap in throughput and yield at the lowest cost of ownership.

    Highest Speed at 10 µm Accuracy

  • Up to 10k UPH including dip fluxing
  • Very short pick & place cycle time due to the revolutionary Phi-Y concept combining rotational and linear movements
  • New "light & rigid" pick & place structure, advanced trajectory control as well as a liquid cooling system, ensuring excellent accuracy at the highest speeds

Cutting-Edge Machine Concept

  • Real time process monitoring through 4 live images of process zone
  • Constant status control with real time wafer, strip and magazine viewer
  • Efficient learning and error recovery thanks to context sensitive online help
  • Fastest time to Yield

  • Tool-less exchange of product specific parts for fastest product changeovers
  • Teach and setup wizards and parameter teach verification eliminate setup errors
  • Recipe transfer from machine to machine enables fast conversion
  • The Platform of the Future

  • New controller hardware using Gigabit Ethernet communication, enabling advanced processes
  • Next generation platform ensuring upgrades and expansion of functionalities at any time
  • Scalable performance & application range
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