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Besi offers flip chip systems for mass production as well as for the high-end sector, covering a wide range of flip chip processes.

Datacon Chameo & Quantum
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 Besi Datacon Chameo & FC Quantum
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The Datacon 8800 FC QUANTUM sigma flip chip bonder represents the next generation of the high-volume, high-accuracy 8800 platform. Beside the factory-proven QUANTUM values it provides superior speed and accuracy while drastically improving your cost-of-ownership.
  • The Datacon 8800 CHAMEO is the pioneer multi-chip flip chip platform, enabling single pass production for higher accuracy and higher yield
  • Advanced interconnection options: heated bond heads and work holders
  • Thermo compression options, wafer chucks for chip-to-wafer bonding and more
Thermo Compression bonding is the key technology for current 2.5D/3D C2S and C2W packaging, with TC-CUF as the currently established process for 3D memory applications.The Datacon 8800 TC advanced sets the new benchmark based on the proven 8800 concept with total process control, advanced capabilities and unsurpassed production stability. With its unique and completely new Advanced Hardware architecture, unique 7-Axis Bond head and Advanced Process capabilities, the Datacon 8800 TC advanced is the essential tool of reference of current TSV applications.
  • Ultra Fine Pitch Capability
  • Enhanced Thermo Compression Bond Control
  • 7-Axis Bond Head
  • Highest Productivity on Smallest Footprint
As mass reflow Flip Chip becomes dominant in IC packaging, Besi again sets the benchmark for speed and productivity with its new Datacon 8800 FC QUANTUM advanced. The state of the art motion control, unique CRYSTAL - glass based fluxer - concept and enhanced computing power showcases the fastest and most cost effective Flip Chip system available today.
  • Highest UPH up to 9000, including dip fluxing
  • Full process and yield control
  • Proven 5 µm accuracy - Unprecedented Speed
  • Unique patent pending CRYSTAL concept (glass based fluxer with simultaneous inspection)
  • Enhanced trajectories and motion control
  • Highest speed with full process control
  • Full Yield Control
  • Full Process & Production control
  • Superior usability with enhanced Pseudo X-Ray
  • Fast Post Bond Inspection
  • Proven Production Accuracy
  • 5 µm accuracy at highest speed
  • Lowest vibration with SMART path filtering
  • Enhanced Matrix BMC test
The Datacon 8800 FC QUANTUM sigma flip chip bonder represents the next generation of the high-volume, high-accuracy 8800 platform. Beside the factory-proven QUANTUM values it provides superior speed and accuracy for Flip Chip applications, whilst drastically improving your cost-of-ownership.
  • Exceptional accuracy of ± 5 microns
  • 3 Sigma at highest speed
  • Higher productivity, higher yields
  • Operator-independent quality by fully automatic machine calibration
  • High Flexibility, no compromise for any Production Process
  • Capability to handle any flip chip size
  • No restriction on substrate type (leadframes, strips, panels, wafers up to 8")
  • Ready for ultra thin die handling, providing high reliability and consistent quality with minimal risk
  • Field-proven, reliable machine concept and production process
  • Matching the requirements of IDMs and subcons (90% market share)
  • Unbeatable benchmark for flip chip assembly equipment
Highest Productivity for FO-WLPAs a new advanced packaging technology, Wafer-Level Fan-Out Packaging (WL-FOP) is a cost effective solution to address increasing demands for performance, form factor, and warpage control.The Datacon 8800 CHAMEO advanced bonder raises a field proven platform concept to an advanced level. It is the perfect fit for chip attach of any WL-FOP process, supporting both face-down (flip mode) and face-up (non flip mode) package designs.Multi-Chip - Combining Speed, Flexibility and Accuracy
  • Multi-chip capability - Flexibility on smallest footprint
  • Single pass is king - Improve your Cpk for multi-FC packages
  • Waffle pack feeders - Extend your possibilities
  • Extra Speed up to +40%Enhanced Capabilities - Ready for the Future
  • Thermo - compression - No limits for your applications
  • Leadframe, strip, boat, wafer - No limits for your substrates
  • Customized features - Exactly tailored for your process
  • 300 mm / 340 mm Fan Out Wafer Level Packages (FO-WLP) Carrier
  • Face - down & Face-up (recipe controlled)
  • Clean room class ISO 5
  • Foup load port
  • Tape & Reel Highest Accuracy - Capturing Tomorrow's Markets
  • Highest Accuracy ± 5 µm/ 3 µm
  • 3 Sigma - For fine-pitch and TSV applications
  • Local reflow - Mastering sophisticated assemblies
  • Long-term stability - Securing high yield at high speed Wafer Level Applications
  • Fan-Out Wafer Level Packages - Highest performance for lowest cost
  • Advanced Chip to Wafer - Cost effective dual die stacking
  • Through Silicon Vias (TSV) - Entry ticket to the future



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