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Automatic Die Bonding

Besi offers a wide range of die attach systems based on cutting-edge technology. The offering includes multi-chip bonders for advanced packaging, epoxy and soft solder bonders, high precision flip chip bonders for mass production, stacked die bonders and die sorting equipment. Besi leads the way in the die attach market, guaranteeing customers future-oriented, customized and flexible solution.

As one of the leaders in die attach for more than two decades, Besi is committed to surpassing its customers' needs by constantly setting new industry standards in die attach. Its die attach platforms constantly demonstrate the company's innovation, strength and sets future industry standards today. Besi's die sorting equipment incorporate advanced technologies and cover a wide variety of processes.

Datacon Chameo & Quantum

Besi offers flip chip systems for mass production as well as for the high-end sector, covering a wide range of flip chip processes.
Datacon Evo

The Datacon 2200 Evo platform of highly flexible and configurable Multi Chip Die Attach systems. Delivering high placement accuracy and repeatability whilst maintaining performance only achievable through a truly industrialised platform.
Esec 2100

In back-end semiconductor manufacturing, the die attach process is a critical step. At first glance, die attach seems to be a simple process step in the semiconductor manufacturing chain. However, the continuously increasing requirements of today's applications set high standards in die bonding. Besi's die attach equipment is based on unique and innovative concepts offering economical benefits to customers.