cyberTECHNOLOGIES CT350T / 250T Double-Sided Non-Contact Metrology System

cyberTECHNOLOGIES CT350T / 250T Double-Sided Non-Contact Metrology System
wafer thickness map
solar front back thickness
Fuel cell Thickness
cyberTECHNOLOGIES CT 350T/250T Double-Sided Non-Contact Metrology System
The CT 350T is a non-contact double-sided optical profilometer with a 300 mm x-, y- scanning stage. The top- and bottom-sensor are mounted on highly accurate z-axes with 100 mm travel. The double sided autofocus function allows the user to measure even extremely bowed or warped parts.

Both sensors collect height data synchronized with x-, y- encoder signals and are aligned axially in order to ensure accurate differential thickness measurements. The software generates 2D profiles and 3D maps simultaneously from the top and the bottom surface and calculates the corresponding total thickness profile or map.

The motion system uses fast and accurate magnetic linear motors. The inspection time is minimized by triggering the chromatic white light sensors at a data rate of 4 kHz. With an adapter plate on the stage aperture, the system can be used as a standard optical surface profilometer, which makes the CT 350T the most versatile surface and thickness measurement system. The system is also available in a smaller version, as the CT 250T with 200 mm travel, ideally for 8" wafers or substrates and solar wafers.
  • 300 mm (200 mm) travel in x- and y-direction, lateral resolution 50 nm, motorized z-axis resolution 20 nm
  • Maximum x-, y-, z-resolution up to the full maximum travel of 300 mm (200 mm)
  • Fast and accurate double-sided scanning system
  • Maximum part thickness to 80 mm
  • Chromatic white light sensors
  • Measurement speed: 2 kHz / 4 kHz / 20 kHz
  • High resolution off-axis camera
  • 2D profiles and 3D topographical maps and 3D thickness maps



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