cyberTECHNOLOGIES CT 300 Non-Contact Profilometer For Large Areas

cyberTECHNOLOGIES CT 300 Non-Contact Profilometer for Large Areas
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3D Scan of Wafer
 full large area scan
Flatness Scan Screen Shot
The CT 300 is a non-contact profilometer with a 315 mm x-, y-motion system. It can handle up 12" wafers or other large substrates and parts.

Using a chromatic white light sensor and a data collection rate of up to 20 kHz the inspection time is minimized. The confocal microscope and 3D white light interferometer sensors offer unmatched resolution in z-direction down to 0.1nm. With our multi-sensor technology several sensor heads can be mounted simultaneously including infrared interferometers for measuring wafer thickness.
  • 315 mm travel in x- and y-direction, lateral resolution 0.05 microns, optional motorized z-axis
  • Large scanning areas, up to the maximum travel of 315 mm with maximum x-, y-, z-resolution
  • Chromatic white light sensors
  • 3D white light interferometer
  • Confocal microscope
  • High-speed confocal line sensor
  • Interferometer for thickness measurement
  • Measurement speed 2kHz / 4kHz / 20 kHz
  • Fast and accurate magnetic linear motors
  • High resolution off-axis camera
  • 2D profiles and 3D topographical maps (topography measurement)
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For further information please visit www.cybertechnologies.com