WEBINAR Next Generation of Convection Soldering – Focus on Resource Efficiency and Digitalization

WEBINAR Next Generation of Convection Soldering – Focus on Resource Efficiency and Digitalization

Convection soldering has been utilized for decades as a robust and cost-effective joining process for manufacturing electronic assemblies.

This method has continuously evolved in response to various requirements. The ongoing situation regarding the availability of resources such as electrical energy and nitrogen, coupled with the simultaneous goal of reducing CO2 emissions, presents new objectives and challenges for both equipment development and soldering process definition. In this webinar, our speakers will introduce Rehm‘s response to these new requirements – VXP+ Next Generation.

Date: April 25, 2024Time: 8:00 am - 9:00 am