Accelonix Tech day : Microelectronics, how small can we go?

This December, Accelonix UK & Ireland opens its doors for a dedicated Tech Day focused on one question at the heart of modern microelectronics: how small can we go?
Join us in Linton, Cambridge, for a full day of discussions, demonstrations and practical insights into precision micro dispensing and wire bonding techniques.

📍 Linton, Cambridge – 10th December 2025
🕘 09:30 to 16:15

Meet industry specialists, attend focused presentations, and watch live demonstrations of equipment designed for microelectronics. Whether you work in R&D, prototyping or production, this event offers a clear view of the challenges and opportunities linked to ever-smaller interconnects and micro-dispensing requirements.

👉 PLACES ARE LIMITED – Confirm your attendance here! or send a message at sales@accelonix.co.uk 👈

📩 Download the agenda

Agenda of the Day

A day designed for learning, exploring and networking:

09:30 – Arrival, Coffee & Informal Networking

10:00 – Accelonix Introduction – Scott Wood, Accelonix UK & Ireland

10:15 – TPT: Wirebonding technology introduction
Case Study 1: How does selecting the type of bond affect how small you can go?
Fabian Hickmann, TPT

10:45 – Musashi: Technology introduction
Case Study 2: What happens when precision meets pressure? Inside micro dispensing.
Okuyama Kaoru, Musashi Engineering

11:15 – Coffee break

11:45 – A.M. Case study demonstrations by group rotation including: Dispensing, wire bonding & non-contact surface metrology with CyberTechnologies

12:45 – Buffet Lunch & Informal Networking

13:45 – TPT Presentation

Case Study 3: What if special tools could let you go small with your interconnects?
Stefan Kaltenbach, TPT

14:15 – Musashi Presentaiton
Case Study 4: Can speed still be precise? Jet dispensing below 100 microns
Okuyama Kaoru, Musashi Engineering

13:55 – Coffee break

15:15 – P.M. Case study demonstrations by group rotation including: Dispensing, wire bonding & 3D X-Ray with Comet Yxlon

16:15 – Final Remarks

👉 PLACES ARE LIMITED – Confirm your attendance here! or send a message at sales@accelonix.co.uk 👈

📩 Download the agenda

Live Equipment Demonstrations

• Musashi Engineering: Image Master 350 PC, Super Sigma CMIV & Super Jet 2 – Dispensing

• TPT: HB05, HB16 & HB100 – Wire bonding

• Comet Yxlon: Cheetah EVO – 3D X-Ray Inspection

• CyberTechnologies: CT300 – Non-Contact Surface Metrology

  

Guest Speakers

	Okuyama Kaoru Managing director at Musashi Engineering Europe Extensive experience within the micro-dispensing industry, Mr Okuyama leads Musashi Engineering Europe in delivering high-precision, micro-dosage dispensing solutions across a wide range of industrial applications.
	Fabian Hickmann Production Manager at TPT Over 20 years of experience in the wire bonding industry, having supported numerous projects across a wide range of applications. Expertise encompassing application support, prototyping, and small-volume production.
	Stefan Kaltenbach Sales Manager at TPT Experienced technical sales specialist within the machine and tooling industry. Expert in defining the optimal machine and tooling configurations for each specific wire bonding application for the global market.

👉 PLACES ARE LIMITED – Confirm your attendance here! or send a message at sales@accelonix.co.uk 👈

📩 Download the agenda

Also on Display

Fully automatic wire bonder & die bonders ,Semi-automatic heavy wire bonder, Semi-automatic die sorter, Laser Marker, 3D AOI system, Smart assembly station, Smart racking & Flying probe measurement testing system.

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