Electronic Applications – 3D non contact surface Metrology

CyberTECHNOLOGIES solutions are used around the  world in many electronic industry sectors and companies. For research and development as well as full in line production solutions, the variety of sensor types and platforms provide the  users with the ability to measure key elements such as thickfilm, flatness and warpage, surface roughness, coplanarity on leads and bumps as well as the measurement of transparent films and coatings, wet or dry and even transparent. High speed measurement can be achieved using the line scanner sensor, which can increase scanning speeds significantly where time is critical.

Coplanarity of BGA grids

Bumps normally consist of highly reflective material and are difficult to measure for an optical system. Especially the edges can be a problem for traditional 3D-systems and only a small area in the middle of the bump is detected. cyberSCAN benefits include effective technology for measuring true bump shape, and accurate measurement of bumps and components, including coplanarity, height, volume, diameter and position.

Good control of the placement and relative heights of the individual balls comprising a ball grid array is essential to ensure good connectivity when placing the device.

A CyberTECHNOLOGIES CT 300L with line sensor is the ideal solution for fast production testing. The line scanner scans 192 points simultaneously. The white light confocal sensor technology means that surface information can be measured even on highly reflective surfaces.

The SCAN CT software suite covers all aspects of setting up, scanning, data acquisition, analysis and reporting, with the additional ASCAN software provides for automated scanning and cursor placement for shape recognition and measurement. The results can be assessed against tolerances for pass/fail decisions.

Key points:

  • Scanning area of 315 x 315 mm
  • 192 point line scanning capacity for high speed data acquisition
  • Statistical Process Control capability
  • camera cameras for setting up and image collection
  • Confocal White Light Sensor effective on highly reflective surfaces
  • z- resolutions to 3 nm
  • 2 and 3D topographical maps

Thickfilm Applications

Controlling the thickness of various print layers on hybrid substrates is essential because electrical parameters are directly related to the thickness. The non-contact measurement technology measures the wet sample immediately after the print with automatic measurement routines to create repeatable and user independent results.

CyberTECHNOLOGIES high resolution non-contact 3D measurement systems are the ideal tool for thickfilm assessment.

The 2D and 3D non-contact measurement solutions from cyberTECHNOLOGIES GmbH have been used in many industries around the world to provide solutions to these and other issues.

With a number of light sensor options, as well as differing platforms, including online solutions, the cyberTECHNOLOGIES product range has a system to suit all applications.

The SCAN CT software suite covers all aspects of setting up, scanning, data acquisition, analysis and reporting, with the additional AScan software to provide test and analysis automation for the production line.

Key points:

  • Hybrid circuits
  • Epoxy print
  • DRAM epoxy resin
  • Solar cells
  • Multi-layered co-fired ceramics
  • Fuel cells

Wafer Applications

The features provided by the cyberTECHNOLOGIES platforms will allow measurement of flatness and surface features  on wafer products to beyond 300 mm diameter. Sensor options can measure flatness to 0.1 nm. The twin sensor versions will provide total thickness variation.

Wafer manufacture can require several parameters to be assessed in the manufacturing process. Typical requirements are for flatness of the wafer, total thickness variation, as well as assessing the quality of the image printed on the surface.

The 2D and 3D non-contact measurement solutions from cyberTECHNOLOGIES GmbH have been used in many industries around the world to provide solutions to these and other issues.

The technology allows for scanning over large surfaces very quickly when looking at flatness. The platforms available are capable of measuring surfaces greater than 300 mm diameter. Surface flatness down to 0.1 nm can be resolved using 3D White Light Interferometry. Utilising the CT “T” series products, sensors above and below the supporting frame will provide Total Thickness Variation, and it is practical to measure features of 2 µm diameter, quickly and automatically.

The SCAN CT software suite covers all aspects of setting up, scanning, data acquisition, analysis and reporting, with the additional ASCAN software to provide test and analysis automation for the production line.

Key points:

  • Area sensors for super smooth surface roughness and small features
  • Point sensors for Wafer flatness and medium feature measurement
  • Table sizes for wafer diameters greater than 300 mm
  • Multiple sensor installations for differing measurement requirements
  • Top and bottom sensor configuration for TTV
  • Full automation of scanning and analysis

GET IN TOUCH

Accelonix Limited
Station Works, Station Road,
Linton,
Cambridge,
CB21 4NW

Tel: +44(0)1223 659965

sales@accelonix.co.uk

Accelonix is a global business. If you’d like to contact our offices in Europe, simply visit our global site.