At this years’ Advanced Engineering Show, hosted by the NEC Exhibition Centre in Birmingham, Accelonix exhibited the latest advances in dispensing and potting technology from Scheugenpflug, alongside the latest 3D Non-Contact Surface Measurement systems from cyberTECHNOLOGIES.
Commenting on the show, which took place between the 31st October and 1st November, Scott Wood, Managing Director of Accelonix, said:
“We are extremely pleased at the level of interest shown in our product portfolio at this years’ Advanced Engineering Show. It was great to welcome so many new customers onto our booth. There is clearly a great deal of relevance to the technologies we offer and customers seemed to really appreciate our ability to support multiple aspects of their assembly process. A great example of this, is the discussion relating to EV battery assembly, linking Scheugenpflug Material Dispensing and Hesse Heavy Wire Bonding technology for the electrical interconnection process.
A show highlight for me was seeing our engineers demonstrate the cyberTECHNOLOGIES Non-Contact 3D Metrology System for customers ‘live on stage’. Many customers brought samples with them and it was great to see them working with our engineers to obtain the information they needed while on our booth. A perfect demonstration of what the technology and Accelonix team are capable of!
This year, interest in Power Electronics has soared, particularly within the Automotive sector. It was clear to see that technologies such as Heavy Wire Bonding, Dispensing Thermal Pastes, Sintering and Vacuum Solder Reflow were all hot topics”.
For more on:
Wire Bonding Click here
Dispensing and Potting Technology Click here
3D Non-Contact Surface MetrologyClick here
We look forward to exhibiting next year and hope to see you there!